The “International Conference on Electronics Materials and Packaging (EMAP)” is a well-established APAC regional conference that promotes awareness of new advances in materials, design and simulations, fabrication, reliability, and thermal management of microsystem/MEMS packages, robot mechanisms and mechanical systems with electronic packaging application. The former eighteen conferences were very successfully hold in Singapore (1999), Hong Kong (2000, 2006, 2012), and Korea (2001, 2007), Taiwan (2002, 2008, 2014), Singapore (2003, 2010), Malaysia (2004, 2009, 2016), and USA (2015). This year, the 19th version of the EMAP2017 was again very successfully organized at Matsue-city, Shimane-pref., Japan, from September 25th to 28th 2017 under the leadership of General Chairperson, Prof. Dr. Mikio HORIE from Tokyo Institute of Technology, Japan. This conference is co- sponsored by JSME, JIEP, JSPE, and Laboratory for Materials and Structures (MSL) in Institute of Innovative Research, Tokyo Institute of Technology, Institute of Innovative Research (Tokyo Institute of Technology). Overall, it was great to have a good engagement from Malaysian delegates who represented by a few companies like ON Semiconductors, Lumileds and Intel Technology, that presented some selected papers and invited keynotes at this prestigious conference. Also, besides the technical knowledge exchange, the team enjoyed the good hospitalities and great Japanese food during the conference event. At the same time, Shaw Fong Wong also shared the “Call for Paper” for IEMT2018 that going to be hold at Malacca, Malaysia, with a very well-received from the EMAP2017 conference attendees. Arigato EMAP2017 and see you again soon in EMAP2018 at Hong Kong!