CH represents Malaysia CPMT chapter to join 18th International Conference on Electronic Packaging Technology (ICEPT) for potential collaboration and benchmarking. This year, ICEPT has 500 delegates from 22 countries with > 370 papers covering nine special themes. The conference is hosted by Harbin Institute of Technology at the beautiful Sun Island Resort. It was attended by current CPMT president Jean Trewhella and ex CPMT president Dr Bill Chen and Dr Ricky Lee. CH presented a keynote entitled Innovations in Power Integrated Module. The Malaysia team received very warm hospitality from China Electronic Packaging team. Great Interactions With local academic team and warm support from professor Bike-Yun. Malaysia CPMT team also extend our Invitation to the great China team to participate in IEMT conference in the world heritage town of Melaka, Malaysia on 4-6 Sept, 2018. We hope the first meeting can spark more future collaborations between China and Malaysia CPMT/Packaging team.