Lim.WeeTeck@onsemi.com

Lim Wee Teck, Secretary

Lim.WeeTeck@onsemi.com

Lim Wee Teck, Secretary

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Past EPS Conference

ALL EVENTS ORGANIZED BY EPS

The following conferences have been tentatively planned for the year 2015, 2016, and 2017. These conferences have been carefully considered and the speakers/invited guests are well selected to bring the utmost benefit and knowledge advancement to EPS members.

EPS Conferences in 2017

2017 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS)

Date: December 14 - December 16 2017

Venue: Hangzhou, China

2017 IEEE 19th Electronics Packaging Technology Conference (EPTC)

Date: December 6 - December 9 2017

Venue: Singapore

2017 IEEE CPMT Symposium Japan (ICSJ)

Date: November 20 - November 22 2017

Venue: Kyoto, Japan

2017 12th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)

Date: October 25 - October 27 2017

Venue: Taipei, Taiwan

2017 IEEE Holm Conference on Electrical Contacts

Date: October 1 - October 4 2017

Venue: CO, USA

2017 23rd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)

Date: September 27 - September 29 2017

Venue: Amsterdam, Netherlands

2017 7th IEEE International Workshop on Advances in Sensors and Interfaces (IWASI)

Date: June 15 - June 16 2017

Venue: Vieste, Italy

2017 16th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)

Date: May 30 - June 2 2017

Venue: Orlando, FL USA

2017 IEEE 67th Electronic Components and Technology Conference (ECTC)

Date: May 30 - June 2 2017

Venue: Orlando, FL USA

2017 28th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC)

Date: May 15 - May 18 2017

Venue: Saratoga Springs, NY USA

2017 IEEE 21st Workshop on Signal and Power Integrity (SPI)

Date: May 7 - May 10 2017

Venue: Baveno (VB), Italy

2017 IEEE International Workshop On Integrated Power Packaging (IWIPP)

Date: April 5 - April 7 2017

Venue: Delft, Netherlands

2017 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)

Date: April 2 - April 5 2017

Venue: Dresden, Germany

2017 Pan Pacific Microelectronics Symposium (Pan Pacific)

Date: February 6 - February 9 2017

Venue: Kauai, HI USA

EPS Conferences in 2016

2016 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS)

Date: December 14 - December 16 2016

Venue: HI, USA

2016 IEEE International 3D Systems Integration Conference (3DIC)

Date: November 8 - November 11 2016

Venue: San Francisco, CA USA

2016 IEEE CPMT Symposium Japan (ICSJ)

Date: November 7 - November 9 2016

Venue: Kyoto, Japan

2016 IEEE 25th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)

Date: October 23 - October 26 2016

Venue: Tampa, FL USA

2016 IEEE 62nd IEEE Holm Conference on Electrical Contacts (Holm)

Date: October 9 - October 12 2016

Venue: Tampa, FL USA

2016 6th Electronic System-Integration Technology Conference (ESTC)

Date: September 13 - September 16 2016

Venue: Grenoble, France

2016 Electronics Goes Green 2016+ (EGG)

Date: September 7 - September 9 2016

Venue: Berlin, Germany

2016 17th International Conference on Electronic Packaging Technology (ICEPT)

Date: August 16 - August 19 2016

Venue: Wuhan, China

2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)

Date: May 31 - June 3 2016

Venue: Las Vegas, NV USA

2016 IEEE 66th Electronic Components and Technology Conference (ECTC)

Date: May 31 - June 3 2016

Venue: Las Vegas, NV USA

2016 27th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC)

Date: May 16 - May 19 2016

Venue: Saratoga Springs, NY USA

2016 IEEE 20th Workshop on Signal and Power Integrity (SPI)

Date: May 8 - May 11 2016

Venue: Turin, Italy

2016 17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)

Date: April 17 - April 20 2016

Venue: Montpellier, France

2016 32nd Thermal Measurement, Modeling & Management Symposium (SEMI-THERM)

Date: March 14 - March 17 2016

Venue: San Jose, CA USA

2016 China Semiconductor Technology International Conference (CSTIC)

Date: March 13 - March 14 2016

Venue: Shanghai, China

EPS Conferences in 2015

2015 IEEE 23rd Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)

Date: October 26 – October 29 2015

Venue: Portland, OR USA

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2015 IEEE 24th Electrical Performance of Electronic Packaging & Systems (EPEPS)

Date: October 25 – October 28 2015

Venue: San Jose, CA USA

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2015 20th European Microelectronics Packaging Conference (EMPC)

Date: September 14 – September 16 2015

Venue: Friedrichshafen, Germany

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2015 Workshop on Accelerated Stress Testing & Reliability (ASTR)

Date: September 9 – September 11 2015

Venue: Boston, MA USA

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2015 16th International Conference on Electronic Packaging Technology (ICEPT)

Date: August 11 – August 14 2015

Venue: Changsha, China

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6th Asia Symposium on Quality Electronic Design (ASQED 2015): Internet of Things (IoT)

Date: August 3 – August 5 2015

Venue: Penang, Malaysia

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2015 65th IEEE Electronic Components & Technology Conference (ECTC 2015)

Date: May 26 – May 29 2015

Venue: San Diego, CA USA

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