EPS Event « EPS Malaysia

Past Events by EPS Malaysia

ALL EVENTS ORGANIZED BY EPS MALAYSIA

The following activities have been tentatively planned for the year 2015, 2016, 2017, 2018 and 2019. These activities have been carefully considered and the speakers/invited guests are well selected to bring the utmost benefit and knowledge advancement to IEEE-EPS Malaysian Chapter members.

EPS Events in 2021

ML/AI for Advanced Semiconductor Packaging & Electronics Manufacturing

Date: 2nd December 2021 (Thursday)

Venue: CISCO WebEx

Advanced Packaging for Autonomous Driving

Date: 27 July 2021 (Tuesday)

Venue: CISCO WebEx

Sintered Silver As Die Attach Materials

Date: 6 July 2021 (Tuesday)

Venue: CISCO WebEx

Optical Profiler Characterization of Electronic Devices & Packaging Using White Light Interferometry

Date: 2 June 2021 (Wednesday)

Venue: CISCO WebEx

Octagonal Relationship of Engineering Materials for Advanced Packaging

Date: 13 April 2021 (Tuesday)

Venue: CISCO WebEx

EPS Events in 2020

The Evolution Of Lead-Free Solder

Date: December 16 2020

Venue: CISCO WebEx

Webinar on-demand
Note: Login your EPS account to view

Direction and Opportunities in Heterogeneous Integration using Advanced Packaging

Date: October 16 2020

Venue: CISCO Webex

What’s Driving Automotive Electronics Assembly and Packaging

Date: October 14 2020

Venue: CISCO Webex

EPS Events in 2019

IEEE EPS Malaysia: 2019 Semiconductor Advanced Packaging Workshop

Date: September 24 - September 25 2019

Venue: Eastin Hotel, Penang & New World Hotel, Petaling Jaya

20th International Conference on Electronic Packaging Technology (ICEPT)

Date: August 11 - August 15 2019

Venue: Hong Kong Science Park, Shatin

EPS Events in 2017

An Overview of Membership Reward Program

Date: 2017

Venue: Malaysia

2017 Semiconductor Advanced Packaging Workshop

Date: September 26 – September 27 2017

Venue: Eastin Hotel, Penang, Malaysia

19th International Conference on Electronics Materials and Packaging (EMAP2017)

Date: September 25 – September 28 2017

Venue: Kunibiki Messe, Matsue, Shimane, Japan

IEMT 2018 Conference Kick-Off Meeting

Date: August 28 2017

Venue: Penang, Malaysia

18th International Conference on Electronic Packaging Technology (ICEPT)

Date: August 16 – August 19 2017

Venue: Harbin, China

CREST 2017 Semiconductor & Optoelectronics Cluster Bootcamp Summary

Date: August 10 - August 12 2017

Venue: Universiti Sains Malaysia, Penang

CPMT Best Engineering Student Award Update

Date: 2017

Venue: Malaysia

IEEE Malaysia Section Leadership Meeting

Date: February 25 2017

Venue: Grand Blue Wave

37th IEMT – 18th EMAP 2016: Closing Meeting

Date: February 2017

Venue: Malaysia

Chapter AGM 2017

Date: January 14 2017

Venue: Bluewave Hotel, Shah Alam

EPS Events in 2016

IEEE Malaysia Section Website Competition

Date: 2016

Venue: Malaysia

IEEE R10 Chapter Chair Meeting at EPTC Singapore

Date: December 2 2016

Venue: EPTC Singapore

IEEE CPMT Malaysia Best Final Year Project (FYP) Undergraduate Prizes 2016

Date: 2016

Venue: Malaysia

IEEE-CPMT IMPACT Taiwan Conference

Date: October 26 - October 28 2016

Venue: Taipei Nangang Exhibition Center, Taiwan

Summary of 37th IEMT & 18th EMAP 2016 Conference

Date: September 22 2016

Venue: Georgetown, Penang, Malaysia

CPMT-CREST Collaboration Discussion

Date: April 7 2016

Venue: Penang, Malaysia

Leadership Camp and Chapter Chair Meeting

Date: March 12 2016

Venue: Grand Bluewave Hotel, Shah Alam, Malaysia

37th IEMT – 18th EMAP 2016: Packaging the Internet of Things

Date: 2016

Venue: G-Hotel, Penang, Malaysia

Minutes of Chapter AGM 2016

Date: January 30 2016

Venue: Pullman Hotel, Bangsar, Malaysia

EPS Events in 2015

Project Management Industry Evaluation At USM Chemical Engineering

Date: November 20 2015

Venue: Universiti Sains Malaysia, Penang

Benchmarking Trip and Invited Speaker At IMPACT 2015 Taiwan

Date: October 21 - October 23 2015

Venue: Taipei Nangang Exhibition Center, Taipei, Taiwan

IEEE CPMT Malaysia Awards Coverage

Date: September 8 2015

Venue: Curtin Sarawak, Miri

Semiconductor Advanced Packaging Workshop 2015

Date: September 7 - September 8 2015

Venue: G Hotel, Penang & Shangri-La Hotel, Putrajaya

10th IEEE 2015 Regional Symposium on Micro and Nano Electronics

Date: August 19 – August 21 2015

Venue: Primula Beach Hotel, Kuala Terengganu, Malaysia

Engaging The Student Members: KBU Innovation Day

Date: June 11 2015

Venue: KBU

Industry-Academia Forum

Date: March 25 2015

Venue: Malaysia

Education Talk

Date: March 18 2015

Venue: Universiti Kebangsaan Malaysia

IEEE Best FYP Project Awards 2015

Date: March - September 2015

Venue: Malaysia