Lim Wee Teck, Secretary

Lim Wee Teck, Secretary


Upcoming Events


The following activities have been tentatively planned for the year 2019. These activities have been carefully considered and the speakers/invited guests are well selected to bring the utmost benefit and knowledge advancement to IEEE-EPS Malaysian Chapter members.

Semiconductor Advanced Packaging Workshop

Course Title:
Session 1 (0830 – 1230): “Intelligent Digital Convergence for AI and 5G” – by Professor Dr. Madhavan Swaminathan/ Georgia Tech
Session 2 (1330 – 1730): “Fan-out Wafer/Panel-level Packaging and Heterogeneous Integrations (SiPs)” – by Dr. John H. Lau/ ASM
Date: Sept 24, 2019 (Penang) and Sept 25, 2019 (Selangor)

Venue: Eastin Hotel, Penang  & New World Hotel, Petaling Jaya

BESA Award- EPS Malaysia Best Final Year Project (FYP) for Undergraduate

Date: Apr – Sep 2019

Upcoming EPS Conferences

2019 IEEE 23rd Workshop on Signal and Power Integrity (SPI)

Date: Jun 18, 2019 - Jun 21, 2019

Venue: Chambéry, France

2019 IEEE Holm Conference on Electrical Contracts

Date: Sep 14, 2019 - Sep 18, 2019

Venue: Milwaukee, WI USA

2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC)

Date: Sep 16, 2019 - Sep 19, 2019

Venue: Pisa, Italy

2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)

Date: May 26, 2020 - May 29, 2020

Venue: Lake Buena Vista, FL USA

2020 IEEE 70th Electronic Components and Technology Conference (ECTC)

Date: May 26, 2020 - May 29, 2020

Venue: Lake Buena Vista, FL USA

2021 IEEE 71st Electronic Components and Technology Conference (ECTC)

Date: Jun 1, 2021 - Jun 4, 2021

Venue: San Diego, CA USA

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