Lim.WeeTeck@onsemi.com

Lim Wee Teck, Secretary

Lim.WeeTeck@onsemi.com

Lim Wee Teck, Secretary

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Upcoming Events

UPCOMING EVENTS ORGANIZED BY EPS MALAYSIA

The following activities have been tentatively planned for the year 2019. These activities have been carefully considered and the speakers/invited guests are well selected to bring the utmost benefit and knowledge advancement to IEEE-EPS Malaysian Chapter members.

Semiconductor Advanced Packaging Workshop

Date: Sept 2019
Time: TBD
Venue: North and Center of Malaysia

BESA Award- EPS Malaysia Best Final Year Project (FYP) for Undergraduate

Date: Apr- Sep 2019

Upcoming EPS Conferences

2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)

Date: Mar 24, 2019 - Mar 27, 2019

Venue: Hannover, Germany

2019 IEEE International Workshop on Integrated Power Packaging (IWIPP)

Date: Apr 24, 2019 - Apr 26, 2019

Venue: Toulouse, France

2019 30th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC)

Date: May 6, 2019 - May 9, 2019

Venue: Saratoga Springs, NY USA

2019 IEEE 69th Electronic Components and Technology Conference (ECTC)

Date: May 25, 2019 - Jun 2, 2019

Venue: Las Vegas, NV USA

2019 18th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)

Date: May 29, 2019 - May 31, 2019

Venue: Las Vegas, NV USA

2019 IEEE 8th International Workshop on Advances in Sensors and Interfaces (IWASI)

Date: Jun 13, 2019 - Jun 14, 2019

Venue: Otranto, Italy

2019 IEEE 23rd Workshop on Signal and Power Integrity (SPI)

Date: Jun 18, 2019 - Jun 21, 2019

Venue: Chambéry, France

2019 IEEE Holm Conference on Electrical Contracts

Date: Sep 14, 2019 - Sep 18, 2019

Venue: Milwaukee, WI USA

2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC)

Date: Sep 16, 2019 - Sep 19, 2019

Venue: Pisa, Italy

2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)

Date: May 26, 2020 - May 29, 2020

Venue: Lake Buena Vista, FL USA

2020 IEEE 70th Electronic Components and Technology Conference (ECTC)

Date: May 26, 2020 - May 29, 2020

Venue: Lake Buena Vista, FL USA

2021 IEEE 71st Electronic Components and Technology Conference (ECTC)

Date: Jun 1, 2021 - Jun 4, 2021

Venue: San Diego, CA USA

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